报告人：Prof. BengOng（王明顺教授） 香港浸会大学化学系材料科学讲座教授、有机电子科学卓越研究中心主任，创意学院副院长。
报告摘要：The interest in printed electronics has exploded over the lastdecade owing to its potential for creating novel impactful large-area,lightweight, flexible, and low-cost electronics. To realize this technologyvision, manufacture of semiconductor devices by high-throughput roll-to-rollprinting, instead of slow, batch-wise photolithographic processes, would beparamount. Printed electronics offers a low-cost and eco-friendliermanufacturing approach to a wide spectrum of semiconductor devices includingnext-gen displays, ultra-low-cost RFIDs, smart labels and packaging, sensorsand images, etc. Foremost among critical enablers to propel this paradigm shiftin manufacturing is a performance-fulfilling materials suite and compatibleprocesses for fabricating functionally-capable transistors- the fundamentalbuilding blocks of modern microelectronics. This presentation discusses theissues, challenges, and advances in materials and process development forprinted electronics over the last decade and the outlook for this emergingtechnology moving forward. It aims to shed light on whether this emergingtechnology is all fantasy and hypes or innovations and opportunities ofimpactful commercial values for our times and beyond.